What is SoC?
SoC stands for System on Chip. If we say that the core of a computer is the CPU in the PC era, then in the era of smart terminals, the core of a mobile phone is the SoC.
This is because SoC integrates many of the most critical components of a mobile phone, such as CPU, GPU, and memory. In other words, although it is just a chip on the motherboard, SoC is composed of many components packaged. For example, Qualcomm Snapdragon 865, Snapdragon 8 Gen 1, etc, which we usually say, are all general terms for system components packaged (SoC). The contents of each package are different, and the names are also different.
For example, Qualcomm's SoC is often highly integrated, with APU/GPU (Krait), GPU (Adreno), RAM (running memory), Modem (communication module), ISP (image processor), DSP (digital signal processing), Codec (encoder), etc. Among so many parts, the Modem communication module has the greatest advantage. The reason why Qualcomm SoC is favored by major mobile phone manufacturers is that it has high integration. All the functions required by the system are integrated into one chip. Mobile phone manufacturers do not need to purchase additional components, and the motherboard space will be more abundant, which will also help reduce power consumption.
Of course, when designing terminal products, mobile phone manufacturers will also partially adopt the functions integrated in SoC according to their own needs. There are also SoC suppliers who choose to integrate more or fewer components in SoC due to technical barriers or strategic needs.
In short, the design of any SoC is a balance between performance, power consumption, stability, and process difficulty. It is relatively easy to achieve any single indicator. What really troubles R&D personnel is to achieve balance. In theory, the higher the integration, the better, and it is as far as possible to develop in the direction of high integration and low power consumption. However, the higher the integration, the more difficult it is to package and debug, and R&D personnel are constantly exploring and adjusting the balance point.
This is because SoC integrates many of the most critical components of a mobile phone, such as CPU, GPU, and memory. In other words, although it is just a chip on the motherboard, SoC is composed of many components packaged. For example, Qualcomm Snapdragon 865, Snapdragon 8 Gen 1, etc, which we usually say, are all general terms for system components packaged (SoC). The contents of each package are different, and the names are also different.
For example, Qualcomm's SoC is often highly integrated, with APU/GPU (Krait), GPU (Adreno), RAM (running memory), Modem (communication module), ISP (image processor), DSP (digital signal processing), Codec (encoder), etc. Among so many parts, the Modem communication module has the greatest advantage. The reason why Qualcomm SoC is favored by major mobile phone manufacturers is that it has high integration. All the functions required by the system are integrated into one chip. Mobile phone manufacturers do not need to purchase additional components, and the motherboard space will be more abundant, which will also help reduce power consumption.
Of course, when designing terminal products, mobile phone manufacturers will also partially adopt the functions integrated in SoC according to their own needs. There are also SoC suppliers who choose to integrate more or fewer components in SoC due to technical barriers or strategic needs.
In short, the design of any SoC is a balance between performance, power consumption, stability, and process difficulty. It is relatively easy to achieve any single indicator. What really troubles R&D personnel is to achieve balance. In theory, the higher the integration, the better, and it is as far as possible to develop in the direction of high integration and low power consumption. However, the higher the integration, the more difficult it is to package and debug, and R&D personnel are constantly exploring and adjusting the balance point.
Does it help?
Yes
No